International Symposium on Semiconductor ManufacturingMOZUMDER, P. K; SAXENA, Sharad.IEEE transactions on semiconductor manufacturing. 1996, Vol 9, Num 4, pp 477-535, issn 0894-6507Conference Proceedings

2000 International Symposium on Semiconductor ManufacturingHATTORI, Takeshi.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 180-206, issn 0894-6507Conference Proceedings

International Symposium on Semiconductor Manufacturing (ISSM'98)HATTORI, T; DOERING, R. R.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 269-322, issn 0894-6507Conference Proceedings

Daily scheduling for R&D semiconductor fabricationLIAO, D.-Y; CHANG, S.-C; PEI, K.-W et al.IEEE transactions on semiconductor manufacturing. 1996, Vol 9, Num 4, pp 551-561, issn 0894-6507Conference Paper

Monitoring multistage integrated circuit fabrication processesRAO, S; STROJWAS, A. J; LEHOCZKY, J. P et al.IEEE transactions on semiconductor manufacturing. 1996, Vol 9, Num 4, pp 495-505, issn 0894-6507Conference Paper

New microcharacters for wafer identificationSUZUKI, Eiko; MATSUDA, Hajime; CHIBA, Teiichirou et al.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 180-186, issn 0894-6507Conference Paper

Patterning tool characterization by causal variability decompositionYU, C; LIU, H.-Y; SPANOS, C. J et al.IEEE transactions on semiconductor manufacturing. 1996, Vol 9, Num 4, pp 527-535, issn 0894-6507Conference Paper

An efficient treatment technique for TMAH wastewater by catalytic oxidationHIRANO, Keiji; OKAMURA, Junji; TAIRA, Tsutomu et al.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 202-206, issn 0894-6507Conference Paper

Autonomous on-wafer sensors for process modeling, diagnosis, and controlFREED, Mason; KRÜGER, Michiel; SPANOS, Costas J et al.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 255-264, issn 0894-6507Conference Paper

Manufacturing cost of active-matrix liquid-crystal displays as a function of plant capacityJURICHICH, S; WOOD, S. C; SARASWAT, K. C et al.IEEE transactions on semiconductor manufacturing. 1996, Vol 9, Num 4, pp 562-572, issn 0894-6507Conference Paper

Mechanical interactions and their effects on chemical mechanical polishingLEI SHAN; CHUNHONG ZHOU; DANYLUK, Steven et al.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 207-213, issn 0894-6507Conference Paper

A simulation study of copper reflow characteristics in viasFRIEDRICH, L. J; DEW, S. K; BRETT, M. J et al.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 353-365, issn 0894-6507Conference Paper

Improvement in oxide thickness uniformity by repeated spike oxidationHONG, Chao-Chi; LEE, Chuang-Yuan; HSIEH, Yuan-Long et al.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 227-230, issn 0894-6507Conference Paper

Mask stretching for next generation lithography masksHUSTON, Dryver R; SAUTER, Wolfgang.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 214-217, issn 0894-6507Conference Paper

Dynamic bottleneck control in wide variety production factoryNAKATA, T; MATSUI, K; MIYAKE, Y et al.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 273-280, issn 0894-6507Conference Paper

Analysis of the impact of proximity correction algorithms on circuit performanceCHEN, L; MILOR, L. S; OUYANG, C. H et al.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 313-322, issn 0894-6507Conference Paper

Estimating and controlling atomic chlorine concentration via actinometryHANISH, C. K; GRIZZLE, J. W; TERRY, F. L et al.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 323-331, issn 0894-6507Conference Paper

Application of covariance structures to improve the fit of response surfaces to simulation dataWARING, T. G; WALTON, A. J; FERGUSON, S et al.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 366-374, issn 0894-6507Conference Paper

Sequential modeling of via formation in photosensitive dielectric materials for MCM-D applicationsTAE SEON KIM; MAY, G. S.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 345-352, issn 0894-6507Conference Paper

Analysis of mixed-signal manufacturability with statistical technology CAD (TCAD)HANSON, D. A; GOOSSENS, R. J. G; REDFORD, M et al.IEEE transactions on semiconductor manufacturing. 1996, Vol 9, Num 4, pp 478-488, issn 0894-6507Conference Paper

Spurious source/drain underlap of large junction area NFET'sHOOK, T. B.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 381-382, issn 0894-6507Conference Paper

An automated approach on electrical technology characterization and analysisPERELLO, C; LOZANO, M; MILLAN, J et al.IEEE transactions on semiconductor manufacturing. 1996, Vol 9, Num 4, pp 573-577, issn 0894-6507Conference Paper

Uniformity optimization techniques for rapid thermal processing systemsACHARYA, Narasimha; KIRTIKAR, Vidula; SHOOSHTARIAN, Sohaila et al.IEEE transactions on semiconductor manufacturing. 2001, Vol 14, Num 3, pp 218-227, issn 0894-6507Conference Paper

As good as it gets : Optimal fab design and deploymentBENAVIDES, D. L; DULEY, J. R; JOHNSON, B. E et al.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 281-287, issn 0894-6507Conference Paper

An iterative cutting procedure for determining the optimal wafer exposure patternCHIEN, C.-F; HSU, S.-C; CHEN, C.-P et al.IEEE transactions on semiconductor manufacturing. 1999, Vol 12, Num 3, pp 375-377, issn 0894-6507Conference Paper